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Amalebula Ezingubo Zenjoloba L-S5512

I-L-S5512 iyithegi ye-silicone ye-RFID. Le lebula yezingubo zenjoloba ye-silicone yenziwe ngezinto ze-silicone, ezingenawo amanzi, umswakama-umswakama, izinga lokushisa eliphezulu nokumelana nokucindezela. Le lebula ye-silicone ye-RFID iphinde ibe yithegi ye-RFID eqinile engaqinisekisa impilo yesevisi yezikhathi zokuwasha zezimboni ezingaphezu kuka-250. I-L-S5512 yinhle futhi ithambile, kulula ukuyifaka. amalebula ezingubo zenjoloba ye-silicone aphephile, awanabo ubuthi, awakwazi ukugqokwa futhi aqinile, ilebula ye-elekthronikhi eluhlaza okotshani eklanyelwe imikhakha yobungcweti efana nokuphrinta indwangu kanye nemboni yokudaya, imboni yokuwasha, izinto zezokwelapha, futhi ingasetshenziselwa okunye ukushisa okuphezulu, umswakama ophezulu. , izinga eliphezulu lokusebenza nezinye izikhathi zokusebenza.

Xhumana nathi LANDA IDATHASHEET

Ukuhlukaniswa

Maka Izinto	I-FPC
Izinto Ezisetshenziswa Phansi	I-Silicone
Ubukhulu	55 x 12 x 2.5 mm
Ukufakwa	Thunga kumphetho noma ilebula elukiwe
Ukumelana Nokushisa	Ukugeza: 90 ℃, 15 min, 250 imijikelezo Ukomisa ngaphambili: 180 ℃, imizuzu engama-30 Uku-ayina: 180 ℃, 10 sec, 250 imijikelezo Ukuvalwa: 135℃, imizuzu engama-20
IP Classification	IP68
Ukumelana Kwamakhemikhali	Amakhemikhali avamile avamile ezinkambisweni zokugeza
Mechanical Resistance	20 imigoqo
Iwaranti	Iminyaka emi-2 noma imijikelezo yokuwasha engama-250
I-RF Air Protocol	I-EPC Global Class 1 Gen2 ISO18000-6C
Imvamisa Yokusebenza	UHF 860-960 MHz
Ukuvumelana Kwemvelo	Kulungiselelwe emoyeni
Funda Ibanga	Kufika ku-9.5 m(emoyeni)
Uhlobo lwe-IC	Impinj R6P
Ukucushwa Kwenkumbulo	I-EPC 128 bit User 32bit

Ishadi lokuhlola ukusebenza ku-Voyantic:

Incazelo Yomkhiqizo

Ilebula yenjoloba yezingubo yakhiwe nge-antenna yethusi ku-substrate ye-FPC kanye ne-UHF chip ephaketheni le-QFN. I-chip ye-UHF ephaketheni le-QFN kanye nothi lwethusi kuxhunywe ngogesi ukuze kwakheke umsebenzi wokuhlonza ifrikhwensi yomsakazo. Umsebenzi we-RFID ongenzi lutho owakhiwe uthilo lwethusi ku-substrate ye-FPC kanye ne-chip ye-UHF ephaketheni le-QFN iyi-inlay evalwe endaweni evalekile yerabha ye-silicone ukuze kuzuze ukuvikelwa kokwelapha abicah.Omaki benjoloba bethu bezingubo, njenge-L-S5512 kungenzeka ukuthuthukisa kakhulu futhi kuvikelwe ukuzinza kwethegi ye-inlay RFID ezindaweni ezinonya ngokomzimba namakhemikhali ngokuvikela i-epoxy-antenna yethusi esekwe ku-FPC kanye ne-QFN-encapsulated UHF chip ngaphakathi kwegobolondo lerabha ye-silicone eshisiwe, okwenza amalebula ezingubo ze-RFID akwazi ukuzivumelanisa nezimo. izidingo zokushisa okuphezulu nokucindezela, ukushuba okuqinile namandla aphezulu okuhlanekezela, ukugqwala okuqinile kanye nezinye imvelo yokuwasha.

incazelo2

Idatha ye-RTEC RFID